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Improvement of Schottky power diode performance by electrode geometry and surround trenching of Schottky contact

conference contribution
posted on 2024-10-31, 20:13 authored by Stanley Luong, Yue Pan, Mohammad Saleh N Alnassar, Anthony HollandAnthony Holland
This work aims to improve the performance of Sic Schottky power diode with the alternative approach by using trenching around the Schottky electrode. The research was done with PATRAN, a finite modelling method (FEM). The modelling was done with the building of samples with different geometries into two types (the first without trenching around the Schottky electrode and the second was with trenching around Schottky electrode) with the same current through put for every models from both groups). The results show that there is big improvement as the Schottky electrode can take as much as two times the current with the trenching samples in comparison to the non-trenched samples.

History

Related Materials

  1. 1.
    DOI - Is published in 10.1109/TENCON.2016.7848461
  2. 2.
    ISBN - Is published in 9781509025978 (urn:isbn:9781509025978)

Start page

2401

End page

2403

Total pages

3

Outlet

Proceedings of the 2016 IEEE Region 10 Conference (TENCON 2016)

Name of conference

TENCON 2016

Publisher

IEEE

Place published

United States

Start date

2016-11-22

End date

2016-11-25

Language

English

Copyright

© 2016 IEEE

Former Identifier

2006070190

Esploro creation date

2021-06-18

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