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Investigating extremely low resistance ohmic contacts to silicon carbide using a novel test structure

conference contribution
posted on 2024-10-31, 17:30 authored by Yue Pan, Aaron Collins, Fahid Algahtani, Patrick LeechPatrick Leech, Geoffrey Reeves, Philip Tanner, Anthony HollandAnthony Holland
Low resistance contracts to highly doped silicon carbide (SiC) are investigated. Using a novel test structure that is easy to fabricate and easy to use, this paper demonstrates how it is used to reliably determine relatively low specific contact resistivities which vary with heat treatment. The test structure requires no error correction and is not affected by parasitic resistances. Using the test structure, small changes in specific contact resistivity are determined for small temperature changes. Results will be presented and discussed on the application of this novel test structure for nickel to highly doped SiC.

History

Related Materials

  1. 1.
    DOI - Is published in 10.1117/12.2033910
  2. 2.
    ISSN - Is published in 0277786X

Start page

1

End page

5

Total pages

5

Outlet

Proceedings of SPIE, Micro/Nano Materials, Devices, and Systems, Vol. 8923

Editors

J. Friend and H. Hoe Tan

Name of conference

SPIE Micro+Nano Materials, Devices, and Systems

Publisher

International Society for Optical Engineering (SPIE)

Place published

Bellingham, WA, United States

Start date

2013-12-09

End date

2013-12-11

Language

English

Copyright

© 2013 SPIE

Former Identifier

2006044043

Esploro creation date

2020-06-22

Fedora creation date

2014-05-20

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