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Effects of thermal properties on tracking and erosion resistance of micro-ATH/AlN/BN filled silicone rubber composites

journal contribution
posted on 2024-11-02, 20:21 authored by Muhammad Tariq NazirMuhammad Tariq Nazir, B. Phung, Shihu Yu, Shengtao Li
Silicone rubber is a hydrophobic polymer which is widely employed for high voltage outdoor insulation. The material offers excellent electrical performance under contaminated environments. However, pristine silicone rubber has low thermal properties and this may cause tracking and erosion failure due to severe dry band arcing and ohmic heating on the insulating surface. This work investigates the effect of material thermal characteristics on the tracking and erosion resistance of silicone rubber filled with micron sized alumina tri-hydrate (ATH), aluminum nitride (AlN) and boron nitride (BN) particles. Composites with different loading were synthesized by dispersing particles in pristine room temperature vulcanizing (RTV) silicone rubber and IEC 60587 inclined plane test (IPT) was conducted to evaluate tracking and erosion resistance. Apart from physical parameters and leakage current, an infrared thermal imager was used to measure the surface temperature distribution during the course of IPT. Experimental results showed tracking and erosion resistance is significantly enhanced with addition of BN particles followed by ATH. AlN composites exhibit poor tracking and erosion resistance, similar to pristine silicone rubber. It is concluded that addition of BN-composites improves ability to impede the tracking and erosion process, the reasons being better thermal stability and enhanced thermal conduction in the discharge region. On the other hand, infrared analysis revealed thermal accumulation is remarkably higher in AlN-composites which promotes dry band arcing and results in tracking and erosion failure.

History

Journal

IEEE Transactions on Dielectrics and Electrical Insulation

Volume

25

Issue

6

Start page

2076

End page

2085

Total pages

10

Publisher

IEEE

Place published

United States

Language

English

Copyright

© 2018 IEEE

Former Identifier

2006116080

Esploro creation date

2023-04-28