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Embroidered Active Microwave Composite Preimpregnated Electronics-Pregtronics

journal contribution
posted on 2024-11-02, 05:29 authored by Thomas Baum, Richard Ziolkowski, Kamran GhorbaniKamran Ghorbani, Kevin Nicholson
The rapid development of the embroidery of conductive threads into textiles and associated biomedical sensors and on-body antennas has given rise to many healthcare and emergency response applications. In this paper, we investigate the embroidery of conductive threads directly into a grade of composites called 'preimpregnated' (pre-preg) materials. These pre-preg materials differ from traditional textiles in that they contain a B-staged epoxy resin that must be baked in an autoclave at temperatures greater than 170 °C, and under pressures upward of 700 kPa to achieve their maximum strength. The experimental characterization of pre-preg-realized transmission line structures embroidered with different types of threads, stitches, and sewing techniques establishes the best fabrication approaches. Unlike embroidery of conductive threads into textiles, the high processing temperatures and pressures of composite materials result in conductivity and dispersion properties similar to those found in copper. We demonstrate how to incorporate passive and active electronic circuit elements directly into this structural material and its subsequent durability during the hardening process. An embroidered pre-preg electronic (pregtronic) ultrawideband amplifier is realized numerically and confirmed experimentally. Because pre-pregs have a relatively long shelf life when stored within a freezer, as well as the capability to be conformably molded to any surface, the study of pregtronics lends itself to the development of storable, conformal electronics for aerospace, automotive, and other structural applications.

History

Journal

IEEE Transactions on Microwave Theory and Techniques

Volume

64

Number

7568995

Issue

10

Start page

3175

End page

3186

Total pages

12

Publisher

Institute of Electrical and Electronics Engineers

Place published

United States

Language

English

Copyright

© 2016 IEEE.

Former Identifier

2006077018

Esploro creation date

2020-06-22

Fedora creation date

2017-08-22

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