Multilayer metallized ceramic composites: LTCC processing and thermal simulation

Thermal performance of metallized low temperature co-fired ceramic (LTCC) composites was investigated in this paper. Seven metallized LTCC composites with different structures were designed and fabricated by traditional LTCC process. The thermal conductivity of the metallized LTCC composites with thermal vias was enhanced by inserting parallel silver layers within the composites. The thermal performance of high power LED package based on the metallized LTCC composite substrates was simulated by finite element analysis method. The results demonstrated that horizontal heat dissipation was very important except for vertical thermal vias in the LTCC substrate. Copyright © Taylor & Francis Group, LLC.